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HB56A172E

Features: · 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm· Single 5 V (± 5%) supply· High speed -Access time: tRAC = 60/70/80 ns (max) tCAC = 20/25/25 ns (max)· Low power dissipation -Active mode: 10.73/9.79/8.84 W (max) -Standby mode: 525 mW (max)· Buffered inputs except RAS an...

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SeekIC No. : 004358880 Detail

HB56A172E: Features: · 168-pin socket type package (Dual lead out) -Lead pitch: 1.27 mm· Single 5 V (± 5%) supply· High speed -Access time: tRAC = 60/70/80 ns (max) tCAC = 20/25/25 ns (max)· Low power dissipat...

HB56A172E Data Sheet

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Part Number:
HB56A172E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
     -Lead pitch: 1.27 mm
·  Single 5 V (± 5%) supply
·  High speed
     - Access time: tRAC = 60/70/80 ns (max)
       tCAC = 20/25/25 ns (max)
·  Low power dissipation
     - Active mode: 10.73/9.79/8.84 W (max)
     - Standby mode: 525 mW (max)
·  Buffered inputs except RAS and DQ
·  4 Byte interleave enabled, Dual Address inputs (A0/B0)
·  Fast page mode capability
·  1,024 refresh cycle : 16 ms
·  2 variations of refresh
     - RAS -only refresh
     - CAS -before-RAS refresh
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
19
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A172E belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications.

The HB56A172E is a 1 M × 72 ECC mode dynamic RAM module, mounted 18 pieces of 4 Mbit DRAM(HM514400CTT) sealed in TSOP package and 2 pieces of 16 bit BiCMOS line driver (74ABT16244) sealed in TSSOP package. An outline of the product  is 168-pin socket type package (dual lead out).

Therefore, the HB56A172E makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted beside the each TSOP on the module board.




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