Features: • Supplied in Compact and Thin Package Requires Only a Small Mounting Area• 4th generation (trench gate structure) IGBT• Enhancement-mode• 4-V gate drive voltage: VGE = 4.0 V (min) (@IC = 150 A)• Peak collector current: IC = 150 A (max)Specifications ...
GT8G131: Features: • Supplied in Compact and Thin Package Requires Only a Small Mounting Area• 4th generation (trench gate structure) IGBT• Enhancement-mode• 4-V gate drive voltage: V...
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SYMBOL | PARAMETER | RATING | UNIT |
VCES | Collector to base voltage | 400 | V |
VGES | Collector to emitter voltageDC | ±6 | V |
VGES | Emitter to base voltagePulse | ±8 | V |
IC | Collector current DC | 8 | A |
ICP | Collector current 1 ms | 150 | A |
PC | Collector power dissipation (Note 1) | 1.1 | W |
Tj | Junction temperature | 150 | |
Tstg | Storage temperaturerange | -55 to +150 |
Note 1: Drive operation: Mount on glass epoxy board [1 inch2 * 1.5 t]
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).