Features: • For surface mounted applications• Low profile package• Ideal for automated placement• High temperature soldering : 260/10 seconds at terminals• Glass Passivated Chip Junction• In compliance with EU RoHS 2002/95/EC directivesSpecifications PARA...
GS1010FL: Features: • For surface mounted applications• Low profile package• Ideal for automated placement• High temperature soldering : 260/10 seconds at terminals• Glass Passiv...
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PARAMETER |
SYMBOL |
GS1000FL |
GS1001FL |
GS1002FL |
GS1004FL |
GS1006FL |
GS1008FL |
GS1010FL |
UNIT |
Marking Code |
1A |
1B |
1D |
1G |
1J |
1K |
1M |
||
Maximum Recurrent Peak Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
Maximum RMS voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
V |
Maximum DC blocking voltage |
VDC |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
Maximum Average Forward Rectified Current(Note1) |
IF(AV) |
1.0 |
A | ||||||
Peak one cycle forward current (non-repetltive) |
IFSM |
30(60HZ) |
A | ||||||
Maximum Forward Voltage at 1.0A |
VF |
1.1 |
V | ||||||
Maximum DC Reverse Current at TA=25 Rated DC Blocking Voltage TJ=125 |
IR |
10 50 |
A | ||||||
Typical Junction Capacitance at 4V,MHZ |
CJ |
4 |
pF |