GS1010FL

Features: • For surface mounted applications• Low profile package• Ideal for automated placement• High temperature soldering : 260/10 seconds at terminals• Glass Passivated Chip Junction• In compliance with EU RoHS 2002/95/EC directivesSpecifications PARA...

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GS1010FL Picture
SeekIC No. : 004355440 Detail

GS1010FL: Features: • For surface mounted applications• Low profile package• Ideal for automated placement• High temperature soldering : 260/10 seconds at terminals• Glass Passiv...

floor Price/Ceiling Price

Part Number:
GS1010FL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/20

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Product Details

Description



Features:

• For surface mounted applications
• Low profile package
• Ideal for automated placement
• High temperature soldering : 260/10 seconds at terminals
• Glass Passivated Chip Junction
• In compliance with EU RoHS 2002/95/EC directives





Specifications

PARAMETER
SYMBOL
GS1000FL
GS1001FL
GS1002FL
GS1004FL
GS1006FL
GS1008FL
GS1010FL
UNIT
Marking Code
1A
1B
1D
1G
1J
1K
1M
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Maximum Average Forward Rectified Current(Note1)
IF(AV)
1.0
A
Peak one cycle forward current (non-repetltive)
IFSM
30(60HZ)
A
Maximum Forward Voltage at 1.0A
VF
1.1
V
Maximum DC Reverse Current at TA=25
Rated DC Blocking Voltage TJ=125
IR
10
50
A
Typical Junction Capacitance at 4V,MHZ
CJ
4
pF





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