Features: · High Thermal Cycling Capability· 800A Per Module· Non Punch Through Silicon· Isolated MMC Base with AlN SubstratesApplication·High Reliability Inverters·Motor Controllers·Traction Drives·Resonant ConvertersSpecificationsStresses above those listed under 'Absolute Maximum Ratings' may c...
GP800DDM18: Features: · High Thermal Cycling Capability· 800A Per Module· Non Punch Through Silicon· Isolated MMC Base with AlN SubstratesApplication·High Reliability Inverters·Motor Controllers·Traction Drives...
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Features: ·High Thermal Cycling Capability·800A Per Module·Non Punch Through Silicon·Isolated MMC ...
Features: · Non Punch Through Silicon· Isolated Copper Baseplate With Al2O3 Substrate· Low Inducta...
Features: ·High Thermal Cycling Capability·800A Per Switch·Non Punch Through Silicon·Isolated MMC ...
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25°C unless stated otherwise
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
VCES | Collector-emitter voltage |
VGE = 0V |
1800 |
V |
VGES | Gate-emitter voltage |
|
±20 |
V |
IC | Collector collector current |
Tcase =65°C |
800 |
A |
IC(PK) | Peak collector current |
1ms, Tcase = 100 °C |
1600 |
A |
Pmax | Max. transistor power dissipation |
Tcase = 25°C, Tj = 150°C |
6940 |
W |
Visol | Isolation voltage |
Commoned terminals to base plate. AC RMS, 1 min, 50Hz |
4000 |
V |