Features: · Non Punch Through Silicon· Isolated Copper Baseplate With Al2O3 Substrate· Low Inductance Internal Construction· Full 1800V Rating· 800A Per ModuleApplication· High Power Inverters· Motor Controllers· Induction Heating· Resonant Converters· ChoppersSpecificationsStresses above those li...
GP800DCS18: Features: · Non Punch Through Silicon· Isolated Copper Baseplate With Al2O3 Substrate· Low Inductance Internal Construction· Full 1800V Rating· 800A Per ModuleApplication· High Power Inverters· Moto...
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Features: ·High Thermal Cycling Capability·800A Per Module·Non Punch Through Silicon·Isolated MMC ...
Features: ·High Thermal Cycling Capability·800A Per Switch·Non Punch Through Silicon·Isolated MMC ...
Features: · High Thermal Cycling Capability· 800A Per Module· Non Punch Through Silicon· Isolated ...
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25°C unless stated otherwise
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
VCES | Collector-emitter voltage |
VGE = 0V |
1800 |
V |
VGES | Gate-emitter voltage |
|
±20 |
V |
IC | Collector collector current |
Tcase =55°C |
800 |
A |
IC(PK) | Peak collector current |
1ms, Tcase = 100 °C |
1600 |
A |
Pmax | Max. transistor power dissipation |
Tcase = 25°C, Tj = 150°C |
6000 |
W |
Visol | Isolation voltage |
Commoned terminals to base plate. AC RMS, 1 min, 50Hz |
4000 |
V |