Features: ·PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)·EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES·LOW FORWARD VOLTA...
GP401: Features: ·PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids...
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Features: ·High Thermal Cycling Capability·400A Per Switch·Non Punch Through Silicon·Isolated MMC ...
Features: ·Non Punch Through Silicon·Isolated Copper Baseplate·Low Inductance Internal Constructio...
PARAMETER (TEST CONDITIONS) | SYMBOL |
RATINGS |
UNITS | ||||||
Series Number | GP400 | GP401 | GP402 | GP404 | GP406 | GP408 | GP410 | ||
Maximum DC Blocking Voltage | VRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | VOLTS |
Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | |
Maximum Peak Recurrent Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | |
Average Forward Rectified Current @ T = 75 , Lead length = 0.375 in. (9.5 mm) | IO |
4. |
AMPS | ||||||
Peak Forward Surge Current (8.3ms Single Half Sine Wave Superimposed on Rated Load) |
IFSM |
200 | |||||||
Maximum Forward Voltage at 4 A Peak DC | VFM |
1 |
VOLTS | ||||||
Maximum Full Cycle Reverse Current @ TL = 75 (Note 1) | IRM(AV) |
20 |
A | ||||||
Maximum Average DC Reverse Current @ TA = 25 At Rated DC Blocking Voltage @ TA = 100 |
IRM |
2 50 | |||||||
Typical Thermal Resistance, Junction to Ambient (Note 1) | RJA |
18 |
/W | ||||||
Typical Junction Capacitance (Note 2) | CJ |
70 |
pF | ||||||
Operating and Storage Temperature Range | TJ,TSTG |
-65 to +175 |