GP400DDM12

Features:

·High Thermal Cycling Capability
·400A Per Switch
·Non Punch Through Silicon
·Isolated MMC Base with AlN Substrates


Application

·High Reliability Inverters
·Motor Controllers
·Traction Drives
·Resonant Converters


Specifications

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
T_case = 25°C unless stated otherwise

Symbol	Parameter	Test Conditions	Max.	Unit
VCES	Collector-emitter voltage	VGE = 0V	1200	V
VGES	Gate-emitter voltage		±20	V
IC	Collector current	Tcase = 80 °C	400	A
IC(PK)	Peak collector current	1ms Tcase = 105°C	800	A
Pmax	Max. transistor power dissipation	Tcase = 25°C, Tj = 150°C	3470	W
Visol	Isolation voltage	Commoned terminals to base plate. AC RMS, 1 min, 50Hz	4000	V

Description

The Powerline range of high power modules GP400DDM12 includes half bridge, dual, chopper and single switch configurations covering voltages from 600V to 3300V and currents up to 2400A.

The GP400DDM12 is a dual switch 1200V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. This device is optimised for traction drives and other applications requiring high thermal cycling capability or very high reliability.

The GP400DDM12 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety.