DescriptionThe EECMOS GAL16V8QS devices are fabricated using National's CS80BEV O.8 Electrically Erasable CMOS process.This advanced process makes National's GAL16V8QS extremely fast, allowing controlled output edge rates which dramatically reduce noise. Low noise is actually specified and guarant...
GAL16V8QS: DescriptionThe EECMOS GAL16V8QS devices are fabricated using National's CS80BEV O.8 Electrically Erasable CMOS process.This advanced process makes National's GAL16V8QS extremely fast, allowing contr...
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The EECMOS GAL16V8QS devices are fabricated using National's CS80BEV O.8 Electrically Erasable CMOS process.This advanced process makes National's GAL16V8QS extremely fast, allowing controlled output edge rates which dramatically reduce noise. Low noise is actually specified and guaranteed with National's GAL16V8QS Quiet SeriesTM devices.
The GAL16V8QS has the following features include:(1)emulates popular PAL devices; (2)fully supported by national's OPAL7M and OPAL jr software as well as 3rd-party PLD development software; (3)commercial and industrial grades; (4)fast programming algorithm---reduces programming cost, increases throughput; (5)electrically erasable cell technology-100% tested at manufacture.National's fast programming algorithm allows the GAL16V8QS to be programmed significantly faster than similar devices using industry standard programmers. Fast programming reduces the cost of programming by greatly increasing programming throughput. National guarantees a minimum of 100 erase/write cycles.
The absolute maximum ratings of the GAL16V8QS are:(1)storage temperature:-65 to +150°C;(2)junction temperature:-65 to +150°C;(3)supply voltage:-0.5 to +7.0V;(4)input voltage:-2.5 to Vcc+1.0V;(5)off-state output voltage:-2.5 to Vcc+1.0V;(6)latchup current:200mA.As system frequencies increase, so do concerns over both device generated and system generated noise. Proper printed circuit board layout and construction techniques should be followed by the designer to minimize system generated noise, additionally however, IC manufacturers should bear the responsibility to minimize device generated noise. One of the biggest sources of device generated noise is ground bounce. Ground bounce not only manifests itself on the ground pin, but more importantly on quiet outputs, input thresholds, and other internal circuitry. Noise on quiet outputs can cause the false triggering of external devices, while a shift in the device's internal ground can cause false triggering and even instability in the device itself. Often these problems are attributed to a damaged or faulty PLD when, in fact, the PLD has marginally lower noise immunity than other seemingly identical devices.
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