Features: • 0.85A, 200V, RDS(on) = 1.35Ω @VGS = 10 V• Low gate charge ( typical 4.0 nC)• Low Crss ( typical 6.0 pF)• Fast switching• 100% avalanche tested• Improved dv/dt capability• Low level gate drive requirement allowing direct opration from logi...
FQT4N20L: Features: • 0.85A, 200V, RDS(on) = 1.35Ω @VGS = 10 V• Low gate charge ( typical 4.0 nC)• Low Crss ( typical 6.0 pF)• Fast switching• 100% avalanche tested• ...
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Symbol | Parameter | FQT7N10 | Units |
VDSS | Drain-Source Voltage | 200 | V |
ID | Drain Current - Continuous (TC = 25°C) - Continuous (TC = 70°C) |
0.85 | A |
0.68 | A | ||
IDM | Drain Current - Pulsed (Note 1) | 3.4 | A |
VGSS | Gate-Source Voltage | ± 20 | V |
EAS | Single Pulsed Avalanche Energy (Note 2) | 52 | mJ |
IAR | Avalanche Current (Note 1) | 0.85 | A |
EAR | Repetitive Avalanche Energy (Note 1) | 0.22 | mJ |
dv/dt | Peak Diode Recovery dv/dt (Note 3) | 5.5 | V/ns |
PD | Power Dissipation (TC = 25°C) - Derate above 25°C | 2.2 | W |
0.018 | W/°C | ||
TJ, TSTG | Operating and Storage Temperature Range |
-55 to +150 | °C |
TL | Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds |
300 | °C |