Features: • The connectors can connect boards in parallel (stacking) at intervals of 8 mm (0.31 in.) to 14 mm (0.55 in.) for various applications.• Connectors with ten different numbers of contacts are available for various purposes: 20 to 100 in steps of ten and 120.• Connectors...
FCN-244F080-G_0: Features: • The connectors can connect boards in parallel (stacking) at intervals of 8 mm (0.31 in.) to 14 mm (0.55 in.) for various applications.• Connectors with ten different numbers ...
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Board to Board / Mezzanine Connectors DDR-3 Vertical Mt Compliant Pin Socket
Features: • 1.27 mm (0.050 in.) pitch contact arrangement in two rows enables high-density m...
Features: • 1.27 mm (0.050 in.) pitch contact arrangement in two rows enables high-density m...
• The connectors can connect boards in parallel (stacking) at intervals of 8 mm (0.31 in.) to 14 mm (0.55 in.) for various applications.
• Connectors with ten different numbers of contacts are available for various purposes: 20 to 100 in steps of ten and 120.
• Connectors are surface mount compatible.
• 1.27 mm (0.050 in.) pitch contact arrangement in two rows enables high-density mounting. Tails are spaced in a four-row staggered arrangement (2.54 mm ´ 1.905 mm) (0.100 in. ´ 0.075 in.) for easy patterning on PC boards.
• Bellows contacts ensure stable contact preventing pins from bending. The bellows contacts also have excellent stability with repeated insertion and extraction.
Item | Specification |
Operating temperature range Current rating Voltage rating Contact resistance Insulation resistance Dielectric withstand voltage |
55°C to +105°C DC 1 A AC 250 V 35 mW max. (DC 6 V, 0.1 A) 1000 MW min. (DC 500 V) AC 750 V for 1 minute |