EBD21RD4ADNA

Features:

• 184-pin socket type dual in line memory module (DIMM)
        -PCB height: 30.48mm
        -Lead pitch: 1.27mm
• 2.5V power supply
• Data rate: 333Mbps/266Mbps (max.)
• 2.5 V (SSTL_2 compatible) I/O
• Double Data Rate architecture; two data transfers perclock cycle
• Bi-directional, data strobe (DQS) is transmitted/received with data, to be used in capturing data atthe receiver
• Data inputs and outputs are synchronized with DQS
• 4 internal banks for concurrent operation(Component)
• DQS is edge aligned with data for READs; centeraligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CKtransitions
• Commands entered on each positive CK edge; datareferenced to both edges of DQS
• Auto precharge option for each burst access
• Programmable burst length: 2, 4, 8
• Programmable /CAS latency (CL): 2, 2.5
• Refresh cycles: (8192 refresh cycles /64ms)
        -7.8µs maximum average periodic refresh interval
• 2 variations of refresh
        -Auto refresh
        -Self refresh
• 1 piece of PLL clock driver, 1 piece of register driverand 1 piece of serial EEPROM (2k bits EEPROM) forPresence Detect (PD)


Specifications

Parameter	Symbol	Value	Unit	Note
Voltage on any pin relative to VSS	VT	1.0 to +3.6	V
Supply voltage relative to VSS	VDD	1.0 to +3.6	V
Short circuit output current	IOS	50	mA
Power dissipation	PT	18	W
Operating ambient temperature	TA	0 to +70		1
Storage temperature	Tstg	-55 to +125

Description

The EBD21RD4ADNA is a 256M words × 72 bits, 2 ranks Double Data Rate (DDR) SDRAM Module, mounting 36 pieces of DDR SDRAM sealed in TCP package. Read and write operations are performed at the cross points of the CK and the /CK. This highspeed data transfer EBD21RD4ADNA is realized by the 2-bit prefetchpipelined architecture. Data strobe (DQS) both for read and write are available for high speed and reliable data bus design. By setting extended mode register, the on-chip Delay Locked Loop (DLL) can be set enable or disable. This module provides high density
mounting without utilizing surface mount technology. Decoupling capacitors are mounted beside each TCP on the module board.