Features: Easily add memory, logic, and I/O to DSP PinoutSpecifications Symbol Parameter Min. Max Unit TSTG Storage Temperature 65 125 °C TLEAD Lead Temperature during Soldering (20 seconds max.)1 235 °C VIO Input and Output Voltage (...
DSM2180F3V: Features: Easily add memory, logic, and I/O to DSP PinoutSpecifications Symbol Parameter Min. Max Unit TSTG Storage Temperature 65 125 °C TLEAD Lead Tem...
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Features: `Glueless Connection to DSP Easily add memory, logic, and I/O to the External Port of AD...
Symbol |
Parameter |
Min. |
Max |
Unit |
TSTG |
Storage Temperature |
65 |
125 |
°C |
TLEAD |
Lead Temperature during Soldering (20 seconds max.)1 |
|
235 |
°C |
VIO |
Input and Output Voltage (Q = VOH or Hi-Z) |
0.6 |
7.0 |
V |
VCC |
Supply Voltage |
0.6 |
7.0 |
V |
VPP |
Device Programmer Supply Voltage |
0.6 |
14.0 |
V |
VESD |
Electrostatic Discharge Voltage (Human Body model) 2 |
2000 |
2000 |
V |
These are system memory devices DSM2180F3V for use with Digital Signal Processors from the popular Analog Devices ADSP-218X family. DSM means Digital signal processor System Memory. A DSM device brings in-system programmable Flash memory, programmable logic, and additional I/O to DSP systems. The result is a simple and flexible twochip solution for DSP designs. DSM devices provide the flexibility of Flash memory and smart JTAG programming techniques for both manufacturing and the field. On-chip integrated memory decode logic and memory paging logic make DSM2180F3V easy to add large amounts of external Flash memory to the ADSP-218X family for bootloading upon power-up and/or overlay memory. The DSM2180F3V DSP accesses this Flash memory using either its Byte DMA (BDMA) interface or as external data overlay memory (no DMA setup overhead).