Features: • Low Cost• Small Size and Low Profile• Industry Standard SOIC-16 SMT Plastic Package• Excellent Repeatability (Lot-to-Lot Variation)• Typical Isolation: 23dB• Typical Amplitude Balance: 0.8dB• Typical Insertion Loss: 1.4dBPinoutSpecifications ...
DS54-0006: Features: • Low Cost• Small Size and Low Profile• Industry Standard SOIC-16 SMT Plastic Package• Excellent Repeatability (Lot-to-Lot Variation)• Typical Isolation: 23dB...
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Parameter | Absolute Maximum |
Input Power2 Operating Temperature Storage Temperature |
1 W CW -40°C to +85°C -65°C to +150°C |
splitter/combiner in a low cost SOIC-16 plastic package. This device is ideally suited for applications where PCB real estate is at a premium and standard packaging for automated assembly and low cost are critical. Typical applications include infrastructure, portables, and peripheral devices (PCMCIA cards) for wireless standards such as PCS, PCN, DECT, PHS, and DCS-1800. Available in Tape and Reel.
The DS54-0006 is fabricated using a passive-integrated circuit process. The process features full-chip passivation for increased performance and reliability.