DS54-0002 Selling Leads, Price trend, DS54-0002 DataSheet download, circuit diagram from SeekIC.com

Features: Small Size and Low ProfileIndustry Standard SOW-16SMT Plastic PackageExcellent Repeatability (Lot-to-Lot Variation)Typical Isolation: 17 dBTypical Amplitude Balance: 0.7dBLow CostTypical Insertion Loss: 1.5dBSpecifications Parameter Absolute Maximum Input Power2 1W CW Oper...

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SeekIC No. : 004329151 Detail

DS54-0002: Features: Small Size and Low ProfileIndustry Standard SOW-16SMT Plastic PackageExcellent Repeatability (Lot-to-Lot Variation)Typical Isolation: 17 dBTypical Amplitude Balance: 0.7dBLow CostTypical I...

DS54-0002 Data Sheet

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Part Number:: DS54-0002
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Month Sales

268 Transactions

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Upload time: 2024/11/23

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Recent History
What is this?

DS54-0001 evaluate
Features: •Small Size and Low Profile •Industry Standard SOW-16 SMT Plastic Package &#...
DS54-0005 evaluate
Features: • Low Cost• Small Size and Low Profile• Industry Standard SOIC-8 SMT P...
DS54-0006 evaluate
Features: • Low Cost• Small Size and Low Profile• Industry Standard SOIC-16 SMT ...

Product Details

Description

Features:

Small Size and Low Profile
Industry Standard SOW-16 SMT Plastic Package
Excellent Repeatability (Lot-to-Lot Variation)
Typical Isolation: 17 dB
Typical Amplitude Balance: 0.7dB
Low Cost
Typical Insertion Loss: 1.5dB

Specifications

Parameter	Absolute Maximum
Input Power²	1W CW
Operating Temperature	-40°C to +85°C
Storage Temperature	-65°C to 150°C

Description

M/A-COM's DS54-0002 is an IC-based monolithic power splitter/combiner in a low cost SOW-16 plastic package. This device is ideally suited for applications where PCB real estate is at a premium and standard packaging for automated assembly and low cost are critical. Typical applications include infrastructure, portables and peripheral devices (PCMCIA cards) for wireless standards such as GSM, A MPS, CDPD, RAM and ARDIS. Available in tape and reel.

The DS54-0002 is fabricated using a passive -integrated circuit process. The process features full -chip passivation for increased performance and reliability.

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DS54-0002

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