Features: • 200 mA Source Capability• Output Tracks within ±10 mV Worst Case• Low Dropout (0.35 V Typ. @ 200 mA)• Low Quiescent Current• Thermal Shutdown• Short Circuit Protection• Wide Operating Range• Internally Fused Leads in SO−8 Package...
CS8182: Features: • 200 mA Source Capability• Output Tracks within ±10 mV Worst Case• Low Dropout (0.35 V Typ. @ 200 mA)• Low Quiescent Current• Thermal Shutdown• Short C...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
• 200 mA Source Capability
• Output Tracks within ±10 mV Worst Case
• Low Dropout (0.35 V Typ. @ 200 mA)
• Low Quiescent Current
• Thermal Shutdown
• Short Circuit Protection
• Wide Operating Range
• Internally Fused Leads in SO−8 Package
• For Automotive and Other Applications Requiring Site and Change Control
Rating | Value | Unit |
Storage Temperature | −65 to 150 | °C |
Supply Voltage Range (continuous) | −15 to 45 | V |
Supply Voltage Range (normal, continuous) | 3.4 to 45 | V |
Peak Transient Voltage (VIN = 14 V, Load Dump Transient = 31 V) |
45 | V |
Voltage Range (Adj, VOUT, VREF/ENABLE) | −10 to 45 | V |
Maximum Junction Temperature | 150 | °C |
Package Thermal Resistance, SO−8: Junction−to−Case, RJC Junction−to−Ambient, RJA |
25 110 |
°C/W °C/W |
Package Thermal Resistance, D2PAK, 5−Pin: Junction−to−Case, RJC Junction−to−Ambient, RJA |
4.0 10−50** |
°C/W °C/W |
ESD Capability (Human Body Model) (Machine Model) |
2.0 200 |
kV V |
Lead Temperature Soldering: Reflow:(SO−8) (Note 1) (D2PAK) |
240 peak 225 peak (Note 2) |
°C |