Features: ·Robust High Voltage Termination·Avalanche Energy Specified·Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode·Diode is Characterized for Use in Bridge Circuits·IDSS and VDS(on) Specified at Elevated Temperature·Isolated Mounting Hole Reduces Mounting Hardwa...
CMT20N50: Features: ·Robust High Voltage Termination·Avalanche Energy Specified·Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode·Diode is Characterized for Use in Bridge Circui...
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Rating | Symbol | Value | Unit |
Drain to Current - Continuous - Pulsed |
ID IDM |
20 60 |
A |
Gate-to-Source Voltage - Continue - Non-repetitive |
VGS VGSM |
±20 ±40 |
V V |
Total Power Dissipation Derate above 25 |
PD | 250 2.00 |
W W/ |
Operating and Storage Temperature Range | TJ, TSTG | -55 to 150 | |
Single Pulse Drain-to-Source Avalanche Energy - TJ = 25 (VDD = 100V, VGS = 10V, IL = 20A, L = 1.38mH, RG = 25Ω) |
EAS | 276 | mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
JC JA |
0.50 40 |
/W |
Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds | TL | 260 |
This high voltage MOSFET CMT20N50 uses an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in avalanche and commutation modes. The new energy efficient design also offers a drain-to-source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, CMT20N50 are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional and safety margin against unexpected voltage transients.