CM1205

• Functionally and pin compatible with CMD&primes PACDN1408 ESD protection device
• 8 transient voltage suppressors in a single package
• Optiguard™ coated for improved reliability at assembly
• In-system Electrostatic Discharge (ESD) protection to ±25kV contact discharge per IEC 61000-4-2 international standard
• Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
• RoHS compliant (lead-free) 10-bump CSP

The CM1205 transient voltage suppressor array provides a very high level of protection for sensitive electronic components that may be subjected to ESD.

The CM1205 will safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge). All I/Os are rated at ±25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30kV.

CM1205 Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill.

The CM1205 features OptiGuard™ coating for improved reliability at assembly and is available with RoHS compliant lead-free finishing.