Features: Fast Read Access Time: 70/90/120/150 ns On-Chip Address and Data Latches Blocked Architecture:• One 8 KB Boot Block w/ Lock Out--Top or Bottom Locations•Two 4 KB Parameter Blocks•One 112 KB Main Block Low Power CMOS Operation12.0V ± 5% Programming and Erase Voltage Auto...
CAT28F001: Features: Fast Read Access Time: 70/90/120/150 ns On-Chip Address and Data Latches Blocked Architecture:• One 8 KB Boot Block w/ Lock Out--Top or Bottom Locations•Two 4 KB Parameter Bloc...
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Fast Read Access Time: 70/90/120/150 ns
On-Chip Address and Data Latches
Blocked Architecture:
• One 8 KB Boot Block w/ Lock Out
--Top or Bottom Locations
•Two 4 KB Parameter Blocks
•One 112 KB Main Block
Low Power CMOS Operation
12.0V ± 5% Programming and Erase Voltage
Automated Program & Erase Algorithms
High Speed Programming
Commercial, Industrial and Automotive Temperature Ranges
Deep Powerdown Mode
•0.05 mA ICC Typical
• 0.8 mA IPP Typical
Hardware Data Protection
Electronic Signature
100,000 Program/Erase Cycles and 10 Year Data Retention
JEDEC Standard Pinouts:
•32 pin DIP
• 32 pin PLCC
• 32 pin TSOP
Reset/Deep Power Down Mode
Temperature Under Bias ......................................................................................................... 55°C to +95°C
Storage Temperature ........................................................................................................... 65°C to +150°C
Voltage on Any Pin with Respect to Ground(1) ................................................................. 2.0V to +VCC + 2.0V
(Except A9, RP, OE, VCC and VPP) Voltage on Pin A9, RP AND OE with Respect to Ground(1) .... 2.0V to +13.5V
VPP with Respect to Ground during Program/Erase(1) .............................................................. 2.0V to +14.0V
VCC with Respect to Ground(1) ................................................................................................... 2.0V to +7.0V
Package Power Dissipation Capability (TA = 25°C) ................................................................................... 1.0 W
Lead Soldering Temperature (10 secs) .................................................................................................... 300°C
Output Short Circuit Current(2) ............................................................................................................... 100 mA