CAT24FC32

Features: Fast mode I2C bus compatible*Max clock frequency:- 400KHz for VCC=2.5V to 5.5VSchmitt trigger filtered inputs for noise suppressionLow power CMOS technology32-byte page write bufferSelf-timed write cycle with auto-clear|Industrial and extendedtemperature rangesWrite protect feature enti...

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CAT24FC32 Picture
SeekIC No. : 004310547 Detail

CAT24FC32: Features: Fast mode I2C bus compatible*Max clock frequency:- 400KHz for VCC=2.5V to 5.5VSchmitt trigger filtered inputs for noise suppressionLow power CMOS technology32-byte page write bufferSelf-ti...

floor Price/Ceiling Price

Part Number:
CAT24FC32
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Fast mode I2C bus compatible*
Max clock frequency:
- 400KHz for VCC=2.5V to 5.5V
Schmitt trigger filtered inputs for noise suppression
Low power CMOS technology
32-byte page write buffer
Self-timed write cycle with auto-clear|
Industrial and extended
temperature ranges
Write protect feature entire array protected when WP at VIH
1,000,000 program/erase cycles
100 year data retention
8-pin DIP, 8-pin SOIC (JEDEC), 8-pin SOIC
(EIAJ), 8-pin TSSOP and TDFN packages




Pinout

  Connection Diagram  Connection Diagram


Specifications

Temperature Under Bias .................   55°C to +125°C
Storage Temperature .......................  65°C to +150°C
Voltage on Any Pin with
Respect to Ground(1) ......................2.0V to +VCC+ 2.0V
VCC with Respect to Ground .................... 2.0V to +7.0V




Description

The CAT24FC32 is a 32K-bit Serial CMOS EEPROM internally organized as 4,096 words of 8 bits each. Catalyst's advanced CMOS technology substantially reduces device power requirements. The CAT24FC32 Catalyst Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol.features a 32-byte page write buffer. The device operates via the I2C bus serial interface and is available in 8-pin DIP, SOIC and TDFN packages




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