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Bt827B

Features: • Single-chip composite/S-Video NTSC/PAL/SECAM to YCrCb digitizer• On-chip UltralockTM• Square Pixel and CCIR601 Resolution for: NTSC (M) NTSC (M) without 7.5IRE pedestal PAL (B, D, G, H, I, M, N, N combination) SECAM• Chroma comb filter• Arbitrary horizonta...

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SeekIC No. : 004302628 Detail

Bt827B: Features: • Single-chip composite/S-Video NTSC/PAL/SECAM to YCrCb digitizer• On-chip UltralockTM• Square Pixel and CCIR601 Resolution for: NTSC (M) NTSC (M) without 7.5IRE pedestal...

Bt827B Data Sheet

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Part Number:
Bt827B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Single-chip composite/S-Video NTSC/PAL/SECAM to YCrCb digitizer
• On-chip UltralockTM
• Square Pixel and CCIR601 Resolution for:
NTSC (M)
NTSC (M) without 7.5IRE pedestal
PAL (B, D, G, H, I, M, N, N combination)
SECAM
• Chroma comb filter
• Arbitrary horizontal and 5-tap vertical filtered scaling
• Hardware closed-caption decoder
• Vertical Blanking Interval (VBI) data pass-through
• Arbitrary temporal decimation for a reduced frame-rate video sequence
• Programmable hue, brightness, saturation, and contrast
• User-programmable cropping of the video window
• 2x oversampling to simplify external analog filtering
• Two-wire Inter-Integrated Circuit (I2C) bus interface
• 8- or 16-bit pixel interface
• YCrCb (4:2:2) output format
• Software selectable four-input analog MUX
• 4 fully programmable GPIO bits
• Auto NTSC/PAL format detect
• Automatic Gain Control (AGC)
• 3.3 V I/O
• Typical power consumption 0.85 W
• IEEE 1149.1 Joint Test Action Group (JTAG) interface
• 100-pin PQFP


Application

• Multimedia
• Image processing
• Desktop video
• Video phone
• Teleconferencing
• Interactive video


Pinout

Connection Diagram


Specifications

 Parameter  Symbol  Min  Typ  Max  Units
 VAA  (measured to AGND)        7.00  V
 VDD  (measured to DGND)        7.00  V
 Voltage on any signal pin (See the note below)    DGND 0.5    VDD  + 0.5  V
 Analog Input Voltage    AGND 0.5    VAA  + 0.5  V
 Storage Temperature  TS  65    +150  
 Junction Temperature  TJ      +125  
 Vapor Phase Soldering
(15 Seconds)		  TVSOL      +220  

Note: Stresses above those listed may cause permanent damage to the device. This is a stress rating only, and functional  operation at these or any other conditions above those listed in the operational section of this specification is not implied.  Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

This device employs high-impedance CMOS devices on all signal pins. It must be handled as an ESD-sensitive device.  Voltage on any signal pin that exceeds the power supply voltage by more than +0.5 V, or drops below ground by more than 0.5 V, can induce destructive latch-up.


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