Features: 12-CHANNEL GAMMA CORRECTION10-BIT RESOLUTIONDOUBLE-BUFFERED DAC REGISTERSINTEGRATED REFERENCE BUFFERSRAIL-TO-RAIL OUTPUTLOW SUPPLY CURRENT: 900A/chSUPPLY VOLTAGE: 7V to 18VDIGITAL SUPPLY: 2.7V to 5.5VINDUSTRY-STANDARD TWO-WIRE INTERFACE− High-Speed Mode: 3.4MHzHIGH ESD RATING:ͨ...
BUF12800: Features: 12-CHANNEL GAMMA CORRECTION10-BIT RESOLUTIONDOUBLE-BUFFERED DAC REGISTERSINTEGRATED REFERENCE BUFFERSRAIL-TO-RAIL OUTPUTLOW SUPPLY CURRENT: 900A/chSUPPLY VOLTAGE: 7V to 18VDIGITAL SUPPLY: ...
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Supply Voltage, VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +20V
Supply Voltage, VSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V
Signal Input Terminals, SCL, SDA, AO, LD:
Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to +6V
Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10mA
Output Short-Circuit(2). . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature. . . . . . . . . . . . . . . . . . . . −40°C to +95°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Lead Temperature (soldering, 10s). . . . . . . . . . . . . . . . . . +300°C
ESD Rating:
Human Body Model (HBM)...... . . . . . . . . . . . . . . . . . . . . . . . 4000V
Charged Device Model (CDM) ........ . . . . . . . . . . . . . . . . . . . 1000V
Machine Model (MM) .... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V
(1) Stresses above these ratings may cause permanent damage.Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not Supported.
(2) Short-circuit to ground, one amplifier per package.This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.