BUF11702

Features:

Gamma Correction Channels: 10, 6
Integrated VCOM Buffer
Excellent Output Current Drive:
  − Gamma Channels: > 30mA at 0.5V Swing to Rails⁽¹⁾
  − V_COM: > 150mA at 5V Swing to Rails⁽¹⁾
Large Capacitive Load Drive Capability
Rail-to-Rail Output
PowerPAD Package
Low-Power/Channel: < 340A
Wide Supply Range: 4.5V to 16V
Specified for 0°C to 85°C
High ESD Rating: 4kV


Specifications

PARAMETERS	BUFXX702	UNIT
Supply, VDD(2)	16.5	V
Input Voltage Range, VI	VDD	V
Continuous Total Power Dissipation	See Dissipation Rating Table
Operating Free-Air Temperature Range, TA	0 to 85	°C
Maximum Junction Temperature, TJ	150	°C
Storage Temperature Range, TSTG	−65 to 150	°C
Lead Temperature 1.6mm (1/16 inch) from case for 10s	260	°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.


Description

The BUF11702 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. The number of gamma correction channels required depends on a  variety of factors and differs greatly from design to design. Therefore, various channel options are offered. For additional space and cost savings, a V_COM channel with higher current drive capability is integrated in the BUF11702 and BUF07702.

The various buffers within the BUFxx702 are carefully matched to the voltage I/O requirements for the gamma correction application. Each buffer is capable of driving heavy capacitive loads and offers fast load current switching. The V_COM channel has increased output drive of > 100mA and can handle even larger capacitive loads.

The BUF07702 and BUF11702 is available in the TSSOP-PowerPAD™ package for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package.

A flow-through pinout has been adopted to allow simple PCB routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx702 incorporate internal ESD protection circuits that prevent functional failures at voltages up to 4kV (HBM) as tested under MIL-STD-883C Method 3015.