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BU4S584

Features: 1) Low current dissipation.2) Super-mini mold package designed for surface mounting.3) Wide range of operating power supply voltage.4) Direct drive of 2 L-TTL inputs and 1 LS-TTL input.Specifications Parameter Symbol Limits Unit Power supply voltage VDD VSS 0.3 ~ VSS + 18 ...

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SeekIC No. : 004303887 Detail

BU4S584: Features: 1) Low current dissipation.2) Super-mini mold package designed for surface mounting.3) Wide range of operating power supply voltage.4) Direct drive of 2 L-TTL inputs and 1 LS-TTL input.Spe...

BU4S584 Data Sheet

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Part Number:
BU4S584
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

1) Low current dissipation.
2) Super-mini mold package designed for surface mounting.
3) Wide range of operating power supply voltage.
4) Direct drive of 2 L-TTL inputs and 1 LS-TTL input.


Specifications

 Parameter  Symbol  Limits  Unit
 Power supply voltage  VDD  VSS 0.3 ~ VSS + 18  V
 Power dissipation  Pd  170  mW
 Input current  IIN   10  mA
 Operating temperature  Topr    40 ~ + 85  
 Storage temperature  Tstg    55 ~ + 150  
 Input voltage  VIN  VSS 0.3 ~ VDD + 0.3  V

Note1. These values indicate the limits at which voltage can be applied to the terminal without causing destruction, but operation is not guaranteed at these values.
Note2. Power dissipation is reduced by 1.7mW for each increase in Ta of 1°C over 25°C.


Description

The BU4S584 is an ultra-compact IC with one circuit of the inverter-type Schmitt trigger, BU4584B, built into an SMP package.


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