Features: • N channel• Enhancement mode• Logic Level• Avalanche rated• VGS(th) = 1.2 ...2.0 VSpecifications Parameter Symbol Value Unit Gate source voltage VGS ±14 V Gate-source peak voltage,aperiodic Vgs ± 20 V Continuous dra...
BSP 319: Features: • N channel• Enhancement mode• Logic Level• Avalanche rated• VGS(th) = 1.2 ...2.0 VSpecifications Parameter Symbol Value Unit Gate source vol...
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Parameter |
Symbol |
Value |
Unit |
Gate source voltage |
VGS |
±14 |
V |
Gate-source peak voltage,aperiodic |
Vgs |
± 20 |
V |
Continuous drain current TA = 29 °C |
ID |
3.8 |
A |
DC drain current, pulsed TA = 25 °C |
IDpuls |
15 |
A |
Avalanche energy, single pulse ID = 3.8 A, VDD = 25 V, RGS = 25 L = 6.2 mH, Tj = 25 °C |
EAS |
90 |
mJ |
Power dissipation TA = 25 °C |
Ptot |
1.8 |
W |
Chip or operating temperature |
Tj |
-55 ... + 150 |
°C |
Storage temperature |
Tstg |
-55 ... + 150 |
°C |
Thermal resistance, chip to ambient air |
RthJA |
70 |
K/W |
Thermal resistance, chip to ambient air 1) |
RthJA |
10 |
K/W |
DIN humidity category, DIN 40 040 |
E |
||
IEC climatic category, DIN IEC 68-1 |
55 / 150 / 56 |