Features: ·VCE 1000 V·I C 2.5 A·N channel·MOS input (voltage-controlled)·High switch speed·Very low tai·current·Latch-up free·Suitable freewheeling diode BAX 280Specifications Parameter Symbol Values Unit Continuous collector currentSoldering point, TS = 25 °CTS = 80 °C IC ...
BSP 280: Features: ·VCE 1000 V·I C 2.5 A·N channel·MOS input (voltage-controlled)·High switch speed·Very low tai·current·Latch-up free·Suitable freewheeling diode BAX 280Specifications Parameter Sy...
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Parameter |
Symbol |
Values |
Unit |
Continuous collector current Soldering point, TS = 25 °C TS = 80 °C |
IC |
2.5 1.5 |
A |
Continuous collector current ambient, TA = 80 °C |
IC |
0.5 |
A |
Pulsed collector current Soldering point, TS = 80 °C |
I C puls |
3.0 |
A |
Collector-emitter voltage |
VCE |
1000 |
V |
Gate-emitter voltage |
VGE |
± 20 |
V |
Power dissipation Soldering point, TS = 80 °C Ambient TA = 25 °C |
Ptot |
10 1.8 |
W |
Operating and storage temperature range |
T j, Tstg |
40 . + 150 |
|
Thermal resistance 1) chip-ambient chip-soldering point |
R thJA R thJS |
70 6 |
°C |
DIN humidity category, DIN 40 040 |
E |
K/W | |
IEC climatic category, DIN IEC 68-1 |
40/150/56 |