IGBT Modules 1200V 150A DUAL
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Product : | IGBT Silicon Modules | Configuration : | Half Bridge Module |
Collector- Emitter Voltage VCEO Max : | 1200 V | Collector-Emitter Saturation Voltage : | 2.5 V |
Continuous Collector Current at 25 C : | 210 A | Gate-Emitter Leakage Current : | 320 nA |
Power Dissipation : | 1.25 KW | Maximum Operating Temperature : | + 150 C |
Package / Case : | Half Bridge2 |
Parameter |
Symbol |
Values |
Unit |
Collector-emitter voltage |
VCE |
1200 |
V |
Collector-gate voltage RGE = 20 k |
VCGR |
1200 | |
Gate-emitter voltage |
VGE |
± 20 | |
DC collector current TC = 25 °C TC = 80 °C |
IC |
210 150 |
A |
Pulsed collector current, tp = 1 ms TC = 25 °C TC = 80 °C |
lCpuls |
420 300 | |
Power dissipation per IGBT TC = 25 °C |
Ptot |
1250 |
W |
Chip temperature |
Tj |
+ 150 |
°C |
Storage temperature |
Tstg |
-55 ... + 150 |
°C |
The BSM150GB120DN2 is designed as one kind of IGBT-Module device that has some points of electrical properties:(1)collector-emitter voltage: 1200 V;(2)DC-collector current: 150 A (Tc=80 °C) or 210 A (Tc=25 °C);(3)Power dissipation per IGBT: 1250 W;(4)Chip temperature: + 150 °C;(5)Storage temperature: -55 to +150 °C;(6)Thermal resistance, chip case: </= 0.1 K/W;(7)Diode thermal resistance, chip case: </= 0.25 K/W;(8)insulation test voltage: 2.5 kV. Features of this device are:(1)half-bridge; (2)including fast free-wheeling diodes; (3)package with insulated metal base plate.
The electrical characteristics of the BSM150GB120DN2 can be summarized as:(1)collector-emitter saturation voltage: 2.5 or 3.1 V;(2)Gate-emitter leakage current: 320 nA;(3)Transconductance: 62 S;(4)input capacitance: 11 nF;(5)reverse transfer capacitance: 0.6 nF;(6)Output capacitance: 1.6 nF;(7)Turn-on delay time: 200 to 400 ns;(8)Rise time: 100 to 200 ns;(9)Turn-off delay time: 600 to 800 ns. If you want to know more information about it, please download the datasheet in www.seekic.com or www.chinaicmart.com .