Features: 25V/60A, RDS(ON)= 5m (typ.) @ VGS= 10V RDS(ON)= 7m (typ.) @ VGS= 4.5VSuper High Dense Cell DesignAvalanche RatedReliable and RuggedApplication Power Management in Desktop Computer or DC/DC ConvertersSpecifications Symbol Parameter Rating Unit Common Ratings (TA = 25°C) VDS...
APM2506NU: Features: 25V/60A, RDS(ON)= 5m (typ.) @ VGS= 10V RDS(ON)= 7m (typ.) @ VGS= 4.5VSuper High Dense Cell DesignAvalanche RatedReliable and RuggedApplication Power Management in Desktop Computer or DC/D...
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Symbol | Parameter | Rating | Unit | |
Common Ratings (TA = 25°C) | ||||
VDSS | Drain-Source Voltage | ±25 | V | |
VGSS | Gate-Source Voltage | ±20 | ||
TJ | Maximum Junction Temperature | 150 | °C | |
TSTG | Storage Temperature Range | -55 to 150 | °C | |
Mounted on Large Heat Sink | ||||
IDP | 300s Pulse Drain Current Tested | TC=25°C | 150 | A |
TC=100°C | 80 | |||
ID | Continuous Drain Current | TC=25°C | 60* | A |
TC=100°C | 40 | |||
PD | Maximum Power Dissipation | TC=25°C | 50 | W |
TC=100°C | 20 | |||
RJC | Thermal Resistance-Junction to Case | 2.5 | °C/W | |
Mounted on PCB of 1in2 pad area | ||||
IDP | 300s Pulse Drain Current Tested | TA=25°C | 150 | A |
TA=100°C | 80 | |||
ID | Continuous Drain Current | TA=25°C | 17 | A |
TA=100°C | 10 | |||
PD | Maximum Power Dissipation | TA=25°C | 2.5 | W |
TA=100°C | 1 | |||
RJA | Thermal Resistance-Junction to Ambient | 50 | °C/W | |
Mounted on PCB of Minimum Footprint | ||||
IDP | 300s Pulse Drain Current Tested | TA=25°C | 150 | A |
TA=100°C | 80 | |||
ID | Continuous Drain Current | TA=25°C | 13 | A |
TA=100°C | 4 | |||
PD | Maximum Power Dissipation | TA=25°C | 1.5 | °C/W |
TA=100°C | 0.5 | °C/W | ||
RJA | Thermal Resistance-Junction to Ambient | 75 | °C/W |