Features: ` 20V/50A, RDS(ON)=6m (typ.) @ VGS=10V RDS(ON)=8m (typ.) @ VGS=4.5V RDS(ON)=16m (typ.) @ VGS=2.5V` Super High Dense Cell Design` Reliable and Rugged` Lead Free Available (RoHS Compliant)Application· Power Management in Desktop Computer or DC/DC ConvertersSpecifications Symbol Par...
APM2007NU: Features: ` 20V/50A, RDS(ON)=6m (typ.) @ VGS=10V RDS(ON)=8m (typ.) @ VGS=4.5V RDS(ON)=16m (typ.) @ VGS=2.5V` Super High Dense Cell Design` Reliable and Rugged` Lead Free Available (RoHS Compliant)Ap...
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Features: · 20V/40A,RDS(ON)=12mW (typ.) @ VGS=4.5VRDS(ON)=18mW (typ.) @ VGS=2.5V· Super High Dense...
Symbol |
Parameter |
Rating |
Unit | |
Common Ratings (TA=25Unless Otherwise Noted) | ||||
VDSS |
Drain-Source Voltage |
20 |
V | |
VGSS |
Gate-Source Voltage |
±16 | ||
TJ |
Maximum Junction Temperature |
150 |
||
TSTG |
Storage Temperature Range |
-55 to 150 |
||
IS | Diode Continuous Forward Current | TC=25 |
30 |
A |
Mounted on Large Heat Sink | ||||
IDP |
300s Pulse Drain Current Tested | TC=25 |
100 |
A |
TC=100 |
80 | |||
ID |
Continuous Drain Current | TC=25 |
50* |
A |
TC=100 |
30 | |||
PD |
Maximum Power Dissipation | TC=25 |
50 |
W |
TC=100 |
20 | |||
RJC |
Thermal Resistance-Junction to Case |
2.5 |
/W | |
Mounted on PCB of 1in2 pad area | ||||
IDP |
300s Pulse Drain Current Tested | TA=25 |
100 |
A |
TA=100 |
80 | |||
ID |
Continuous Drain Current | TA=25 |
15 |
A |
TA=100 |
9 | |||
PD |
Maximum Power Dissipation | TA=25 |
2.5 |
W |
TA=100 |
1 | |||
RJA |
Thermal Resistance-Junction to Ambient |
50 |
/W | |
Mounted on PCB of Minimum Footprint | ||||
IDP |
300s Pulse Drain Current Tested | TA=25 |
100 |
A |
TA=100 |
80 | |||
ID |
Continuous Drain Current | TA=25 |
12 |
A |
TA=100 |
8 | |||
PD |
Maximum Power Dissipation | TA=25 |
1.6 |
W |
TA=100 |
0.6 | |||
RJA |
Thermal Resistance-Junction to Ambient |
75 |
/W |