AM2729-125

Features: .REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAYGEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.POUT=125WMIN.WITH7.0dBGAINPinoutSpecifications Symbol Parameter Value Unit PDISS Power Dissipation* (TC 3 75°C) 500 W IC...

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AM2729-125 Picture
SeekIC No. : 004282106 Detail

AM2729-125: Features: .REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAYGEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.POUT=125WMIN.WITH7.0dBGAINPinoutSpecificat...

floor Price/Ceiling Price

Part Number:
AM2729-125
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

.REFRACTORY/GOLD METALLIZATION
.EMITTER SITE BALLASTED
.LOW THERMAL RESISTANCE
.INPUT/OUTPUT MATCHING
.OVERLAYGEOMETRY
.METAL/CERAMIC HERMETIC PACKAGE
.POUT=125WMIN.WITH7.0dBGAIN



Pinout

  Connection Diagram


Specifications

Symbol Parameter Value Unit
PDISS Power Dissipation* (TC 3 75°C) 500 W
IC Device Current* 16 A
VCC Collector-Supply Voltage* 45 V
TJ Junction Temperature (Pulsed RF Operation) 250 °C
TSTG Storage Temperature - 65 to +200 °C



Description

  The AM2729-125 device is a high power silicon bipolar NPN transistor specifically designed for medium pulse S-Band radar output and driver applications.

  This device is characterized at 50 msec pulse width and 10% duty cycle, but is capable of operation over a range of pulse widths, duty cycles and temperatures. Low RF thermal resistance,refractory/gold metallization and computerized automatic wire bonding techniques ensure high reliability and product consistency (including phase characteristics).

  The AM2729-125 is supplied in the BIGPAC] Hermetic Metal/Ceramic package with internal Input/Output impedance matching circuitry, and is intended for military and other high reliability applications.



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