Features: . REFRACTORY/G . OLD METALLIZATION . EMITTER SITE BALLASTED . 3:1 VSWR CAPABILITY·LOW THERMAL RESISTANCE . INPUT/OUTPUT MATCHING . OVERLAY GEOMETRY . METAL/CERAMIC HERMETIC · PACKAGE POUT = 105 W MIN. WITH 6.5 dB GAINPinoutSpecifications Symbol Parameter Value Unit PDISS...
AM2729-110: Features: . REFRACTORY/G . OLD METALLIZATION . EMITTER SITE BALLASTED . 3:1 VSWR CAPABILITY·LOW THERMAL RESISTANCE . INPUT/OUTPUT MATCHING . OVERLAY GEOMETRY . METAL/CERAMIC HERMETIC · PACKAGE POUT ...
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Features: .REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.LOW THERMAL RESISTANCE.INPUT/OUTPU...
Symbol | Parameter |
Value |
Unit |
PDISS | Power Dissipation* (TC100°C) |
438 |
W |
IC | Device Current* |
12 |
A |
VCC | Collector-Supply Voltage* |
48 |
V |
TJ | Junction Temperature (Pulsed RF Operation) |
250 |
|
TSTG | Storage Temperature |
- 65 to +200 |
The AM2729-110 device is a high power silicon bipolar NPN transistor specifically designed for SBand radar pulsed output and driver applications.
This device is capable of operation over a wide range of pulse widths, duty cycles and temperatures and can withstand a 3:1 output VSWR. Low RF thermal resistance, refractory/gold metallization, and computerized automatic wire bonding techniques ensure high reliability and product consistency (including phase characteristics).
The AM2729-110 is supplied in the BIGPAC™ Hermetic Metal/Ceramic package with internal Input/Output matching circuitry, and is intended for military and other high reliability applications.