Features: Two 8-Bit DACs in One Package 8-Pin DIP/SOIC and microSOIC Packages +2.7 V to +5.5 V Operation Internal & External Reference CapabilityIndividual DAC Power-Down Function Three-Wire Serial Interface QSPI(TM), SPI(TM) and Microwire(TM) Compatible On-Chip Output BufferRail-to-Rail Opera...
AD7303: Features: Two 8-Bit DACs in One Package 8-Pin DIP/SOIC and microSOIC Packages +2.7 V to +5.5 V Operation Internal & External Reference CapabilityIndividual DAC Power-Down Function Three-Wire Ser...
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Two 8-Bit DACs in One Package 8-Pin DIP/SOIC and microSOIC Packages +2.7 V to +5.5 V Operation Internal & External Reference Capability
Individual DAC Power-Down Function Three-Wire Serial Interface QSPI(TM), SPI(TM) and Microwire(TM) Compatible On-Chip Output Buffer
Rail-to-Rail Operation On-Chip Control Register Low Power Operation: 2.3 mA @ 3.3 V Full Power-Down to 1A max, typically 80 nA APPLICATIONS Portable Battery Powered Instruments Digital Gain and Offset Adjustment Programmable Voltage and Current Sources Programmable Attenuators
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Reference Input Voltage to GND . . . . 0.3 V to VDD + 0.3 V
Digital Input Voltage to GND . . . . . . . 0.3 V to VDD + 0.3 V
VOUT A, VOUT B to GND . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . . . . 40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 800 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
MicroSOIC Package, Power Dissipation . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
The AD7303 is a dual, 8-bit voltage out DAC that operates from a single +2.7V to +5.5V supply. Its on-chip precision out-put buffers allow the DAC outputs to swing rail to rail. This de-vice AD7303 uses a versatile 3-wire serial interface that operates at clock rates up to 30MHz, and is compatible with QSPI, SPI, microwire and digital signal processor interface standards. The serial input register AD7303 is sixteen bits wide; 8 bits act as data bits for the DACs,and the remaining eight bits make up a control register.The on-chip control register is used to address the relevant DAC, to power down the complete device or an individual DAC, to select internal or external reference and to provide a synchronous loading facility for simultaneous update of the DAC outputs with a software LDAC function.The low power consumption of this part makes it ideally suited to portable battery operated equipment. The power consump-tion is 7.5mW max at 3V, reducing to less than 3W in full power-down mode.The AD7303 is available in an 8-pin plastic dual in-line pack-age, 8-lead SOIC and microSOIC packages.QSPI and SPI are trademarks of Motorola.Microwire is a trademark of National Semiconductor.