Features: Two 8-Bit DACs In One Package
20-Lead DIP/SOIC/TSSOP Package
+2.7 V to +5.5 V Operation
Internal and External Reference Capability
DAC Power-Down Function
Parallel Interface
On-Chip Output Buffer
Rail-to-Rail Operation
Low Power Operation 3 mA max @ 3.3 V
Power-Down to 1 A max @ 25C
APPLICATIONS
Portable Battery Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable AttenuatorsPinout
Specifications
| Resolution (Bits) |
8bit |
| DAC Update Rate |
833kSPS |
| DAC Settling Time |
1.2s |
| # DAC Outputs |
2 |
| DAC Type |
Voltage Out |
| DAC Input Format |
Par |
| Output FSR |
(Uni Vdd),(Uni Vdd/2),(Uni Vref) |
| Ref Int/Ext |
Int/Ext |
| Supply Vnom |
Single(+3),Single(+3.3),Single(+5) |
| Pwr Diss |
24.8mW |
| Package |
DIP,SOIC,SOP |
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . .. . .. . . . . . . . 0.3 V to +7 V
Reference Input Voltage to AGND . .. . .. . . . .0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . .. . .. . 0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . .. . .. .. . . . . . 0.3 V, 0.3 V
VOUTA, VOUTB to AGND . . . . . . . . . . . .. . .. . .. . 0.3 V, VDD + 0.3 V
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . .. . .. . . . . 40°C to +105°C
Storage Temperature Range . . . . . . . . .. . . . . .65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . .. . . . . .+150°C
Plastic DIP Package, Power Dissipation . . . . . .. . .. . . . . . 900 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . .. . .. . . . . 102°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . .. . .. . . .+260°C
TSSOP Package, Power Dissipation . . . . . . . . . .. . .. . . . . . 700 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . .. . .. . . . 143°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . .. . .. .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . .. . .. .. . .+220°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . .. .. . . . 870 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . .. . .. . . . 74°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . .. . ..+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . .. .+220°C
DescriptionThe AD7302 is a dual, 8-bit voltage out DAC that operates from a single +2.7 V to +5.5 V supply. Its on-chip precision output buffers allow the DAC outputs to swing rail to rail.
The AD7302 has a parallel microprocessor and DSP-compatible interface with high speed registers and double buffered interface logic. Data is loaded to the registers on the rising edge of CS or WR and the A/B pin selects either DAC A or DAC B.Reference selection for AD7302 can be either an internal reference derived from the VDD or an external reference applied at the REFIN pin. Both DACs can be simultaneously updated using the asynchronous LDAC input and can be cleared by using the asynchronous CLR input.The low power consumption of this part makes it ideally suited to portable battery operated equipment.
The power consump-tion is less than 10 mW at 3.3 V, reducing to 3 W in power-
down mode.The AD7302 is available in a 20-pin plastic dual-in-line package,20-lead SOIC and a 20-lead TSSOP package.
AD7302 Data Sheet
