Features: . 2 512K x 8 SRAMs & 2 512K x 8 Flash Die in One MCM. Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70 or 90ns (Flash). 512K x 16 SRAM. 512K x 16 5V Flash. Organized as 512K x 16 of SRAM and 512K x 16 of Flash Memory with Separate Data Buses. Both Blocks of Memory...
ACTSF512K16: Features: . 2 512K x 8 SRAMs & 2 512K x 8 Flash Die in One MCM. Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70 or 90ns (Flash). 512K x 16 SRAM. 512K x 16 5V Flash. Organize...
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Features: • Devices QML Qualified in Accordance with MIL-PRF-38535• Detailed Electrica...
. 2 512K x 8 SRAMs & 2 512K x 8 Flash Die in One MCM
. Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70 or 90ns (Flash)
. 512K x 16 SRAM
. 512K x 16 5V Flash
. Organized as 512K x 16 of SRAM and 512K x 16 of Flash Memory with Separate Data Buses
. Both Blocks of Memory are User Configurable as 1M x 8
. Low Power CMOS
. Input and Output TTL Compatible Design
. MIL-PRF-38534 Compliant MCMs Available
. Decoupling Capacitors and Multiple Grounds for Low Noise
. Industrial and Military Temperature Ranges
. Industry Standard Pinouts
. Packaging Hermetic Ceramic
66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder, Aeroflex code# "P3"
66 Pin, 1.08" x 1.08" x .185" PGA Type, With Shoulder, Aeroflex code# "P7"
68 Lead, .94" x .94" x .140" Single-Cavity Small
Outline Gull Wing, Aeroflex code# "F18" (Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
. DESC SMD Pending 5962-96901
Symbol |
Rating |
Range |
Units |
TC |
Operating Temperature |
-55 to +125 |
°C |
TSTG |
Storage Temperature |
-65 to +150 |
°C |
VG |
Maximum Signal Voltage to Ground |
-0.5 to +7 |
V |
TL |
Maximum Lead Temperature (10 seconds) |
300 |
°C |