HEATSINK BGA W/O SOLDER ANCHORS
374724B60024G: HEATSINK BGA W/O SOLDER ANCHORS
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Technical/Catalog Information | 374724B60024G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Solder Anchor |
Height | 0.709" (18mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 3W @ 50°C |
Thermal Resistance @ Forced Air Flow | 5.2°C/W @ 200 LFM |
Outline | 35.00mm x 35.00mm |
Thermal Resistance @ Natural | 15.3°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 374724B60024G 374724B60024G HS326 ND HS326ND HS326 |