BGA HEAT SINK
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Technical/Catalog Information | 374724B00000 |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Height | 0.709" (18mm) |
Material | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 3W @ 50°C |
Thermal Resistance @ Forced Air Flow | 5.0°C/W @ 200 LFM |
Outline | 35.00mm x 35.00mm |
Thermal Resistance @ Natural | 15.3°C/W |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | 374724B00000 374724B00000 |