Features: • Low drain−source ON resistance : RDS (ON) = 0. 33 (typ.)• High forward transfer admittance : |Yfs| = 8.5 S (typ.)• Low leakage current : IDSS = 100 A (max) (VDS = 500 V)• Enhancement mode : Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)Specifications It...
2SK4107: Features: • Low drain−source ON resistance : RDS (ON) = 0. 33 (typ.)• High forward transfer admittance : |Yfs| = 8.5 S (typ.)• Low leakage current : IDSS = 100 A (max) (VDS ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Item |
Symbol |
Ratings |
Unit | |
Drain-Source Voltage |
VDSS |
500 |
V | |
Drain?gate voltage (RGS = 20 k) |
VDGR |
500 |
V | |
Gate-Source Voltage |
VGSS |
±30 |
V | |
Drain Current | DC (Note 1) |
ID IDP |
15 60 |
A |
Pulse (Note 1) | ||||
Drain power dissipation |
PD |
150 |
W | |
Single-pulse avalanche energy (Note 2) |
EAS |
765 |
mJ | |
Avalanche current |
IAR |
15 |
A | |
Repetitive avalanche energy (Note 3) |
EAR |
15 |
mJ | |
Channel Temperature |
Tch |
150 |
||
Storage Temperature |
Tstg |
-55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).