Features: Low drain−source ON-resistance : RDS (ON) = 4.2 (typ.) High forward transfer admittance : |Yfs| = 1.7 S (typ.) Low leakage current : IDSS = 100 A (max) (VDS = 600 V) Enhancement mode : Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)Specifications ...
2SK4002: Features: Low drain−source ON-resistance : RDS (ON) = 4.2 (typ.) High forward transfer admittance : |Yfs| = 1.7 S (typ.) Low leakage current : IDSS = 100 A (max...
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Characteristics |
Symbol |
Ratings |
Unit | |
Drain-source voltage |
VDSS |
600 |
V | |
Drain-gate voltage (RGS=20 k) |
VDGR |
600 |
V | |
Gate-source voltage |
VGSS |
±30 |
V | |
Drain current | DC (Note 1) |
ID |
2 |
A |
Pulse (t = 100 s) (Note 1) |
IDP |
5 |
A | |
Pulse (t = 100 s) (Note 1) |
IDP |
8 |
A | |
Drain power dissipation |
PD |
20 |
W | |
Single-pulse avalanche energy (Note2) |
EAS |
93 |
mJ | |
Avalanche current |
IAR |
2 |
A | |
Repetitive avalanche energy (Note 3) |
EAR |
2 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
−55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).