Application• Low drain-source ON resistance: RDS (ON) = 0.7 (typ.)• High forward transfer admittance: |Yfs| = 6.5S (typ.)• Low leakage current: IDSS = 100 A (VDS = 500 V)• Enhancement mode: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)Specifications Symbol Characteristic R...
2SK4042: Application• Low drain-source ON resistance: RDS (ON) = 0.7 (typ.)• High forward transfer admittance: |Yfs| = 6.5S (typ.)• Low leakage current: IDSS = 100 A (VDS = 500 V)• En...
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Symbol | Characteristic | Rating | Unit | |
VDSS | Drain-Source Voltage | 500 | V | |
VDGR | Drain?gate voltage (RGS = 20 k) | 500 | V | |
VGSS | Gate?source voltage | ±30 |
V | |
ID IDP |
Drain current | DC (Note 1) | 8 | A |
Pulse (Note 1) | 32 | |||
PD | Drain power dissipation (Tc=25) |
40 | W | |
EAS | Single-pulse avalanche energy (Note 2) |
312 | mJ | |
IAR | Avalanche current | 8 | A | |
EAR | Repetitive avalanche energy (Note 3) | 4 | mJ | |
Tch | Channel temperature | 150 | ||
Tstg | Storage temperature range | -55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).