Features: • Low drain-source ON-resistance: RDS (ON) = 6.4 (typ.)• High forward transfer admittance: |Yfs| = 0.85 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDSS = 600 V)• Enhancement mode: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)Specifications Characterist...
2SK4026: Features: • Low drain-source ON-resistance: RDS (ON) = 6.4 (typ.)• High forward transfer admittance: |Yfs| = 0.85 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDSS = 600 V)...
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Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage |
VDSS |
600 |
V | |
Drain-gate voltage (RGS = 20 k) |
VDGR |
600 |
V | |
Gate-source voltage |
VGSS |
±30 |
V | |
Drain current | DC (Note 1) |
ID |
1 |
A |
Pulse (Note 1) |
IDP |
2 | ||
Drain power dissipation (Tc = 25) |
PD |
20 |
W | |
Single pulse avalanche energy (Note 2) |
EAS |
56 |
mJ | |
Avalanche current |
IAR |
1 |
A | |
Repetitive avalanche energy (Note 3) |
EAR |
2 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
−55 to 150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).