Application2.5-V gate drive Low drain−source ON-resistance : RDS (ON) = 0.18 (typ.)High forward transfer admittance : |Yfs| = 6.0 S (typ.)Low leakage current : IDSS = −100 A (max) (VDS = −16 V) Enhancement mode : Vth = −0.5~−1.1 V (VDS = −10 V, ID = −1 mA...
2SJ439: Application2.5-V gate drive Low drain−source ON-resistance : RDS (ON) = 0.18 (typ.)High forward transfer admittance : |Yfs| = 6.0 S (typ.)Low leakage current : IDSS = −100 A (max) (VDS ...
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Characteristics |
Symbol |
Ratings |
Unit | |
Drain-source voltage |
VDSS |
−16 |
V | |
Drain-gate voltage (RGS=20 k) |
VDGR |
−16 |
V | |
Gate−source voltage |
VGSS |
±8 |
V | |
Drain current | DC (Note 1) |
ID |
−5 |
A |
Pulse (Note 1) |
IDP |
−20 | ||
Drain power dissipation (Tc = 25) |
PD |
20 |
W | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
-55 ~ +150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).