Features: ` Adoption of FBET process..` Very small size making it easy to provide highdensity hybrid IC's.Application· Voltage regulators relay drivers, lamp drivers, electrical equipment.PinoutSpecifications Parameter Symbol Conditions Ratings Unit Collector-to-Base Voltag...
2SD1622: Features: ` Adoption of FBET process..` Very small size making it easy to provide highdensity hybrid IC's.Application· Voltage regulators relay drivers, lamp drivers, electrical equipment.PinoutSpec...
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Parameter |
Symbol |
Conditions |
Ratings |
Unit |
Collector-to-Base Voltage |
VCBO |
()60 |
V | |
Collector-to-Emitter Voltage |
VCEO |
()50 |
V | |
Emitter-to-Base Voltage |
IEBO |
()5 |
V | |
Drain Current |
IC |
()1 |
A | |
Collector Current (Pulse) |
ICP |
()2 |
A | |
Allowable Power Dissipation |
PD |
500 |
W | |
Mounted on ceramic board (250mm2X0.8mm) |
1.3 |
W | ||
Channel Temperature |
Tj |
150 |
°C | |
Storage Temperature |
Tstg |
55 to +150 |
°C |
Absolute maximum ratings | |
---|---|
VCEO [V] | 50 |
IC [A] | 1 |
PC [W] | 1.3
When mounted on ceramic substrate (250mm²*0.8mm) 1unit |
Electrical characteristics | |
---|---|
hFE min | 100 |
hFE max | 560 |
VCE [V] | 2 |
IC [A] | 0.1 |
VCE (sat) typ [V] | 0.12 |
VCE (sat) max [V] | 0.3 |
IC [A] | 0.5 |
IB [mA] | 50 |