Features: Low Voltage Operation for Very Low Power Portable Applications
VCC e 3.0V3.6V
Expanded Temperature Range
b20§Cto a70§C
x8/x16 Input/Output Architecture
28F200BL-T, 28F200BL-B
For High Performance and High Integration 16-bit and 32-bit CPUs
x8-only Input/Output Architecture
28F002BL-T, 28F002BL-B
For Space Constrained 8-bit Applications
Upgradeable to Intel's SmartVoltageProducts
Optimized High-Density Blocked Archit ecture
One 16-KB Protected Boot Block
Two 8-KB Parameter Blocks
One 96-KB Main Block
One 128-KB Main Block
Top or Bottom Boot Locations
Extended Cycling Capability
10,000 Block Erase Cycles
Automated Word/Byte Write and Block Erase
Command User Interface
Status Registers
Erase Suspend Capability
SRAM-Compatible Write Interface
Automatic Power Savings Feature
0.8 mA Typical ICC Active Current in Static Operation
Very High-Performance Read
150 ns Maximum Access Time
65 ns Maximum Output Enable Time
Low Power Consumption
15 mA Typical Active Read Current
Reset/Deep Power-Down Input
0.2 mAICC Typical
Acts as Reset for Boot Operations
Write Protection for Boot Block
Hardware Data Protection Feature
Erase/Write Lockout during Power
Transitions
Industry Standard Surface Mount Packaging
28F200BL: JEDEC ROM Compatible
44-Lead PSOP
56-Lead TSOP
28F002BL: 40-Lead TSOP
12V Word/Byte Write and Block Erase
VPP e 12V g5% Standard
ETOXTM III Flash Technology
3.3V Read
Independent Software Vendor SupportPinoutSpecificationsOperating Temperature
During Read ................-20to 70°C(1)
During Block Erase and
Word/Byte Write ..................0Cto70
Temperature Under Bias .............-20to 80
Storage Temperature..............-65to 125
Voltage on Any Pin
(except VCC,VPP,A9 and RP)
with Respect to GND ............-2.0V to a7.0V(2)
Voltage on Pin RP or Pin A9
with Respect to GND .............-2.0V to 13.5V(2, 3)
DescriptionIntel's 28F002BL-B is an extension of the Boot Block Architecture which includes block-selective erasure, automated write and erase operations and standard microprocessor interface. The 2-Mbit Flash Memory Family enhances the Boot Block Architecture by adding more density and blocks,x8/x16 input/output control, very low power, very high speed, an industry standard ROM compatible pinout and surface mount packaging. The 2-Mbit Low Power Flash Family opens a new capability for 3V battery-oper-ated portable systems and allows for an easy upgrade to Intel's 4-Mbit Low Power Boot Block Flash Memory Family.
The Intel 28F200BL-T/B are 16-bit wide flash memory offerings. These high density flash memories provide user selectable bus operation for either 8-bit or 16-bit applications. The 28F200BL-T and 28F200BL-B are 2,097,152-bit non-volatile memories organized as either 262,144 bytes or 131,072 words of information. They are offered in 44-Lead plastic SOP and 56-Lead TSOP packages. The x8/x16 pinout conforms to the industry standard ROM/EPROM pinout.
The Intel 28F002BL-T/B are 8-bit wide flash memories with 2,097,152 bits organized as 262,144 bytes of information. They are offered in a 40-Lead TSOP package, which is ideal for space-constrained portable systems.
These devices use an integrated Command User Interface (CUI) and Write State Machine (WSM) for simplified word/byte write and block erasure. The 28F200BL-T/28F002BL-T provide block locations compatible with Intel's low voltage MCS-186 family, i386TM, i486TM microprocessors. The 28F200BL-B/28F002BL-B provide compatibility with Intel's 80960KX and 80960SX families as well as other low voltage embedded microproces-sors.
The boot block includes a data protection feature to protect the boot code in critical applications. With a maximum access time of 150 ns, these 2-Mbit flash devices are very high performance low power memories which interface to a wide range of low power microprocessors and microcontrollers. A deep power-down mode lowers the total VCC power consumption to 0.66 mW. This is critical in handheld battery powered systems such as Handy Phones. For very high speed applications using a 5V supply, refer to the Intel 28F200BX-T/B,28F002BX-T/B 2-Mbit Boot Block Flash Memory Family datasheet.
Manufactured on Intel's 0.8 micron ETOX III process, the 2-Mbit low power flash memory family provides world class quality, reliability and cost-effectiveness at the 2-Mbit density level.