24016

` Powerful 16-Bit TMS320C5x CPU
` 20-, 25-, 35-, and 50-ns Single-Cycle Instruction Execution Time for 5-V Operation
` 25-, 40-, and 50-ns Single-Cycle Instruction Execution Time for 3-V Operation
` Single-Cycle 16 * 16-Bit Multiply/Add
` 224K * 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
` 2K, 4K, 8K, 16K, 32K * 16-Bit Single-Access On-Chip Program ROM
` 1K, 3K, 6K, 9K * 16-Bit Single-Access On-Chip Program/Data RAM (SARAM)
` 1K Dual-Access On-Chip Program/Data RAM (DARAM)
` Full-Duplex Synchronous Serial Port for Coder/Decoder Interface
` Time-Division-Multiplexed (TDM) Serial Port
` Hardware or Software Wait-State Generation Capability
` On-Chip Timer for Control Operations
` Repeat Instructions for Efficient Use of Program Space
` Buffered Serial Port
` Host Port Interface
` Multiple Phase-Locked Loop (PLL) Clocking Options (*1, *2, *3, *4, *5, *9 Depending on Device)
` Block Moves for Data/Program Management
` On-Chip Scan-Based Emulation Logic
` Boundary Scan
` Five Packaging Options
  100-Pin Quad Flat Package (PJ Suffix)
  100-Pin Thin Quad Flat Package (PZ Suffix)
  128-Pin Thin Quad Flat Package (PBK Suffix)
  132-Pin Quad Flat Package (PQ Suffix)
  144-Pin Thin Quad Flat Package (PGE Suffix)
` Low Power Dissipation and Power-Down Modes:
  47 mA (2.35 mA/MIP) at 5 V, 40-MHz Clock (Average)
  23 mA (1.15 mA/MIP) at 3 V, 40-MHz Clock (Average)
  10 mA at 5 V, 40-MHz Clock (IDLE1 Mode)
  3 mA at 5 V, 40-MHz Clock (IDLE2 Mode)
  5 mA at 5 V, Clocks Off (IDLE2 Mode)
` High-Performance Static CMOS Technology
` IEEE Standard 1149.1† Test-Access Port (JTAG)

absolute maximum ratings over operating ambient-air temperature range (unless otherwise noted) ('320C5x only)†
Supply voltage range, V_DD (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V
Input voltage range, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V
Output voltage range, V_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  0.3 V to 7 V
Operating ambient temperature range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 to 85
Operating case temperature, T_C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 85
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  55 to 150

† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 3: All voltage values are with respect to V_SS.

The TMS320C5x generation of the Texas Instruments (TIE) TMS320 digital signal processors (DSPs) is fabricated with static CMOS integrated circuit technology; the architectural design is based upon that of an earlier TI DSP, the TMS320C25. The combination of advanced Harvard architecture, on-chip peripherals, on-chip memory, and a highly specialized instruction set is the basis of the operational flexibility and speed of the 'C5x‡ devices. They execute up to 50 million instructions per second (MIPS).

The 'C5x devices offer these advantages:
` Enhanced TMS320 architectural design for increased performance and versatility
` Modular architectural design for fast development of spin-off devices
` Advanced integrated-circuit processing technology for increased performance
` Upward-compatible source code (source code for 'C1x and 'C2x DSPs is upward compatible with 'C5x DSPs.)
` Enhanced TMS320 instruction set for faster algorithms and for optimized high-level language operation
` New static-design techniques for minimizing power consumption and maximizing radiation tolerance