1N5809

Features: · Chip Outline Dimensions: 68 x 68 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 70,000Ã Nominal· Bonding Area: 42 x 42 mils Min.· Back Metallization: Gold-3000Ã Nominal· Junction Passivated with Thermal Silicon Dioxide - Planar...

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1N5809 Picture
SeekIC No. : 004213479 Detail

1N5809: Features: · Chip Outline Dimensions: 68 x 68 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 70,000Ã Nominal· Bonding Area: 42 x 42 mils Min.· Back...

floor Price/Ceiling Price

Part Number:
1N5809
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/6/10

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Product Details

Description



Features:

· Chip Outline Dimensions: 68 x 68 mils
· Chip Thickness: 8 to 12 mils
· Anode Metallization: Aluminum
· Metallization Thickness: 70,000Ã Nominal
· Bonding Area: 42 x 42 mils Min.
· Back Metallization: Gold-3000Ã Nominal
· Junction Passivated with Thermal Silicon Dioxide - Planar Design
· Backside Available with Solderable Ag Backside as JANHCF or JANKCF



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