Features: · Chip Outline Dimensions: 68 x 68 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 70,000Ã Nominal· Bonding Area: 42 x 42 mils Min.· Back Metallization: Gold-3000Ã Nominal· Junction Passivated with Thermal Silicon Dioxide - Planar...
1N5809: Features: · Chip Outline Dimensions: 68 x 68 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 70,000Ã Nominal· Bonding Area: 42 x 42 mils Min.· Back...
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