1N5804

Features: · Chip Outline Dimensions: 41 x 41 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 50,000Ã Nominal· Bonding Area: 23 x 23 mils Min.· Back Metallization: Gold· Junction Passivated with Thermal Silicon Dioxide - Planar Design· Backside Ava...

product image

1N5804 Picture
SeekIC No. : 004213474 Detail

1N5804: Features: · Chip Outline Dimensions: 41 x 41 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 50,000Ã Nominal· Bonding Area: 23 x 23 mils Min.· Back...

floor Price/Ceiling Price

Part Number:
1N5804
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/10/30

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

· Chip Outline Dimensions: 41 x 41 mils
· Chip Thickness: 8 to 12 mils
· Anode Metallization: Aluminum
· Metallization Thickness: 50,000Ã Nominal
· Bonding Area: 23 x 23 mils Min.
· Back Metallization: Gold
· Junction Passivated with Thermal Silicon Dioxide - Planar Design
· Backside Available with Solderable Ag Backside as JANHCF or JANKCF





Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
LED Products
Potentiometers, Variable Resistors
Semiconductor Modules
View more