Features: · Chip Outline Dimensions: 41 x 41 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 50,000Ã Nominal· Bonding Area: 23 x 23 mils Min.· Back Metallization: Gold· Junction Passivated with Thermal Silicon Dioxide - Planar Design· Backside Ava...
1N5804: Features: · Chip Outline Dimensions: 41 x 41 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 50,000Ã Nominal· Bonding Area: 23 x 23 mils Min.· Back...
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