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1.5SMCJ6.0(C)

Features: • For surface mounted applications in order to optimize board space.• Low profile package• Built-in strain relief• Glass passivated junction• Excellent clamping capability• Low inductance• Fast response time: typically less than 1.0 ps from 0 vol...

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SeekIC No. : 004206961 Detail

1.5SMCJ6.0(C): Features: • For surface mounted applications in order to optimize board space.• Low profile package• Built-in strain relief• Glass passivated junction• Excellent clampi...

1.5SMCJ6.0(C) Data Sheet

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Part Number:
1.5SMCJ6.0(C)
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

• For surface mounted applications in order to optimize board space.
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Excellent clamping capability
• Low inductance
• Fast response time: typically less than 1.0 ps from 0 volts to BV min
• Typical IR less than 1µA above 10V
• High temperature soldering : 250°C/10 seconds at terminals.
• Plastic package has Underwriters Laboratory Flammability Classification 94V-O


Specifications

RATING SYMBOL VALUE UNITS
Peak Power Dissipation at TA=25°C, TP=1ms(Note 1,2 ,Fig.1 ) PPPM Minimum 1500 Watts
Peak Forward Surge Current,8.3ms single half sine-wave
superimposed on rated load (Note 2,3)		 IFSM 100.0 Amps
Peak Pulse Current Current on 10/1000µs waveform(Note 1,Fig.3 ) IPPM See Table 1 Amps
Operating and Storage Temperature Range TJ, TSTG -55 to +150



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