Features: For surface mounted application in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Excellent clamping capability Fast response time: Typically less than 1.0ps from 0 volt to BV MIN Typical IRless than 1 A above 10V High temperat...
1.5SMC: Features: For surface mounted application in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Excellent clamping capability Fast response tim...
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Description1.5SMC Series has many kinds of product. al of them have the features as following: 1.P...
Type Number | Symbol | Value | Units |
Peak Power Dissipation at TA=25°C, Tp=1ms (Note 1) | PPK | Minimum 1500 | Watts |
Power Dissipation on IntiniteHeatsink, TA=50OC | PM(AV) | 6.5 | W |
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) (Note 2, 3) -Unidirectional Only | IFSM | 200 | Amps |
Thermal Resistance Junction to Ambient Air (Note 4) | R JA |
50 | °C/W |
Thermal Resistance Junction to Leads | R JL |
15 | °C/W |
Operating and Storage Temperature Range | TJ,TSTG | -50 to +150 | °C |