NMIC Released New Heat Spreader for GaN Devices

Published:2011/9/20 5:20:00 Author:Amy From:SeekIC

Nano Materials International is dedicated to the development and commercialization of products based on nano-materials and nano-processes such as transparent ceramics for transparent ballistic protection (Spinel) and aluminum diamond metal matrix composites (MMCs) for thermal management applications in the electronics industry. Currently, it introduced the first commercial device-level solution for dissipating the heat generated by high-density semiconductor devices.

When used as a heat spreader integrated with a device, NMIC’s new aluminum diamond metal matrix composites (MMCs), have demonstrated their ability to decrease device junction temperatures by up to 25%, allowing the devices to generate their full power output at their highest efficiency.

GaN is the latest advancement in compound semiconductor technology in generating high levels of RF power over wide frequency ranges. GaN devices have much higher power density than other technologies as measured by the amount of power they can generate in given amount of device gate periphery. This power density, however, also causes the production of large amounts of waste heat which should be eliminated from the device.

Diamond has the highest thermal conductivity of any substance on Earth. When made as an aluminum-diamond composite and used as a heat spreader material, this property remains about 80% higher than its nearest competitor, copper-molybdenum-copper, which is used for this purpose. Aluminum diamond also has a coefficient of thermal expansion (CTE) close to that of silicon carbide (SiC), which is essential as most GaN devices employ SiC as their substrate material. NMIC’s aluminum diamond also has metallization properties well suited for die attach, along with excellent dimensional tolerance and material stability.

NMIC’s MMC material with nickel-gold electrolytic or electroless plating is available in thicknesses, shapes, and sizes required by GaN transistors or Microwave Monolithic Integrated Circuits (MMICs). It can be supplied as MMC material alone or incorporated within a package in order to meet the needs of device manufacturers and package suppliers.

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