Index B : BYM11-50,BYM11-400,BYD71E,

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BYM11-50
Vendor:Other Category:Other
BYM11-50 thru BYM11-1000 datasheet
BYM11-400
Mfg:GS D/C:02+ Vendor:Other Category:Other
BYM11-50 thru BYM11-1000 datasheet
BYM11-200
Vendor:Other Category:Other
BYM11-50 thru BYM11-1000 datasheet
BYM11-1000
Vendor:Other Category:Other
BYM11-50 thru BYM11-1000 datasheet
BYM11-100
Mfg:Vishay Pack:DO-213AB D/C:08+ Vendor:Other Category:Other
BYM11-50 thru BYM11-1000 datasheet
BYM10-800
Mfg:GS Vendor:Other Category:Other
BYM10-50 thru BYM10-1000 datasheet
BYM10-600
Mfg:VISHAY Vendor:Other Category:Other
BYM10-50 thru BYM10-1000 datasheet
BYM10-50
Vendor:Other Category:Other
BYM10-400
Mfg:GS Pack:DO-214 D/C:04+ Vendor:Other Category:Other
BYM10-50 thru BYM10-1000 datasheet
BYM10-200
Mfg:GS Vendor:Other Category:Other
BYM10-50 thru BYM10-1000 datasheet
BYM10-1000
Mfg:GS Pack:LL-41 D/C:09+ Vendor:Other Category:Other
BYM10-50 thru BYM10-1000 datasheet
BYM10-100
Mfg:. Pack:LL33 D/C:2008+ Vendor:Other Category:Other
BYM10-50 thru BYM10-1000 datasheet
BYM07-50
Vendor:Other Category:Other
BYM07-400
Vendor:Other Category:Other
BYM07-300
Mfg:Vishay Pack:DO-213AA D/C:08+ Vendor:Other Category:Other
BYM07-50 thru BYM07-400 datasheet
BYM07-200
Mfg:Vishay Pack:DO-213AA D/C:08+ Vendor:Other Category:Other
BYM07-50 thru BYM07-400 datasheet
BYM07-150
Mfg:Vishay Pack:DO-213AA D/C:08+ Vendor:Other Category:Other
BYM07-50 thru BYM07-400 datasheet
BYM07-100
Mfg:Vishay Pack:DO-213AA D/C:08+ Vendor:Other Category:Other
BYM07-50 thru BYM07-400 datasheet
BYG90-90
Vendor:Other Category:Other
The BYG 90-90 BYG90-90 is a Schottky barrier rectifier diode, fabricated in planar technology, and encapsulated in the rectangular SOD106A plastic SMD package.
BYG90-40
Mfg:PHI Pack:SOD-6 Vendor:Other Category:Other
The BYG 90-40 series BYG90-40 consists of Schottky barrier rectifier diodes, fabricated in planar technology, and encapsulated in rectangular SOD106A plastic SMD packages.
BYG90-30
Vendor:Other Category:Other
The BYG 90-40 series BYG90-30 consists of Schottky barrier rectifier diodes, fabricated in planar technology, and encapsulated in rectangular SOD106A plastic SMD packages.
BYG90-20
Vendor:Other Category:Other
The BYG 90-40 series BYG90-20 consists of Schottky barrier rectifier diodes, fabricated in planar technology, and encapsulated in rectangular SOD106A plastic SMD packages.
BYG85B
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG85B with glass passivated chip.The well-defined void-free case of BYG85B is of a transfer-moulded thermo-setting plastic.
BYG80J
Mfg:PHILIPS Pack:SMA D/C:05+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80J is of a transfer-moulded thermo-setting plastic.
BYG80G
Mfg:PHILIPS Pack:SMA D/C:01+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80G is of a transfer-moulded thermo-setting plastic.
BYG80F
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80F is of a transfer-moulded thermo-setting plastic.
BYG80D
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80D is of a transfer-moulded thermo-setting plastic.
BYG80C
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80C is of a transfer-moulded thermo-setting plastic.
BYG80B
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80B is of a transfer-moulded thermo-setting plastic.
BYG80A
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80A is of a transfer-moulded thermo-setting plastic.
BYG80
Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG80 is of a transfer-moulded thermo-setting plastic.
BYG70J
Mfg:PHI Pack:SOD106 D/C:06+ Vendor:Other Category:Other
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case of BYG70J is of a transfer-moulded thermo-setting plastic.
BYG70G
Mfg:PHILIPS Pack:SMD D/C:2008+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG70G with glass passivated chip.The well-defined void-free case of BYG70G is of a transfer-moulded thermo-setting plastic.
BYG70D
Mfg:Philips Pack:SOD106 D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG70D with glass passivated chip.The well-defined void-free case of BYG70D is of a transfer-moulded thermo-setting plastic.
BYG70
Vendor:Other Category:Other
DO-214AC surface mountable package BYG70 with glass passivated chip.The well-defined void-free case of BYG70 is of a transfer-moulded thermo-setting plastic.
BYG60M
Mfg:PHILIPS Pack:SMD D/C:2008+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG60M with glass passivated chip.The well-defined void-free case of BYG60M is of a transfer-moulded thermo-setting plastic.
BYG60K
Mfg:PHILIPS Pack:SMD D/C:2008+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG60K with glass passivated chip.The well-defined void-free case of BYG60K is of a transfer-moulded thermo-setting plastic.
BYG60J
Mfg:1A,600V Vendor:Other Category:Other
DO-214AC surface mountable package BYG60J with glass passivated chip.The well-defined void-free case of BYG60J is of a transfer-moulded thermo-setting plastic.
BYG60G
Mfg:PHILIPS Pack:SMD D/C:2008+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG60G with glass passivated chip.The well-defined void-free case of is of BYG60G a transfer-moulded thermo-setting plastic.
BYG60D
Mfg:N/A Pack:NA/ D/C:09+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG60D with glass passivated chip.The well-defined void-free case of BYG60D is of a transfer-moulded thermo-setting plastic.
BYG60
Vendor:Other Category:Other
DO-214AC surface mountable package BYG60 with glass passivated chip.The well-defined void-free case of BYG60 is of a transfer-moulded thermo-setting plastic.
BYG50M
Mfg:100000 Pack:PHILIPS D/C:2008 Vendor:Other Category:Other
DO-214AC; SOD106 surface mountable package with glass passivated chip.The well-defined void-free case of BYG50M is of a transfer-moulded thermo-setting plastic.
BYG50K
Mfg:SOD106 Pack:9000 D/C:PHI Vendor:Other Category:Other
DO-214AC; SOD106 surface mountable package with glass passivated chip.The well-defined void-free case of BYG50K is of a transfer-moulded thermo-setting plastic.
BYG50J
Mfg:Philips Vendor:Other Category:Other
DO-214AC; SOD106 surface mountable package with glass passivated chip.The well-defined void-free case of BYG50J is of a transfer-moulded thermo-setting plastic.
BYG50G
Mfg:100000 Pack:PHILIPS D/C:2008 Vendor:Other Category:Other
DO-214AC; SOD106 surface mountable package with glass passivated chip.The well-defined void-free case of BYG50G is of a transfer-moulded thermo-setting plastic.
BYG50D
Mfg:100000 Pack:PHILIPS D/C:2008 Vendor:Other Category:Other
DO-214AC; SOD106 surface mountable package with glass passivated chip.The well-defined void-free case of BYG50D is of a transfer-moulded thermo-setting plastic.
BYG26J
Mfg:PHILIPS Pack:DO-214 D/C:05+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG26J with glass passivated chip.The well-defined void-free case of BYG26J is of a transfer-moulded thermo-settingplastic.Thesmallrectangularpackagehas two J bent leads.
BYG26G
Mfg:PHILIPS D/C:2004 Vendor:Other Category:Other
DO-214AC surface mountable package BYG26G with glass passivated chip.The well-defined void-free case of BYG26G is of a transfer-moulded thermo-settingplastic.Thesmallrectangularpackagehas two J bent leads.
BYG26D
Mfg:Philips Pack:DO-214AC D/C:2009+ Vendor:Other Category:Other
DO-214AC surface mountable package BYG26D with glass passivated chip.The well-defined void-free case of BYG26D is of a transfer-moulded thermo-settingplastic.Thesmallrectangularpackagehas two J bent leads.
BYG26
Vendor:Other Category:Other
DO-214AC surface mountable package BYG26 with glass passivated chip.The well-defined void-free case of BYG26 is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads.
BYG24J
Mfg:VISHAY Pack:DO-214AC (SMA) D/C:2009+ Vendor:Other Category:Other
BYG24D thru BYD24J datasheet
BYG24G
Vendor:Other Category:Other
BYG24D thru BYD24J datasheet
BYG24D
Mfg:Vishay Pack:DO-214AC D/C:08+ Vendor:Other Category:Other
BYG24D thru BYD24J datasheet
BYG24
Vendor:Other Category:Other
BYG23M
Vendor:Other Category:Other
BYG22D
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG22A thru BYD22D datasheet
BYG22B
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG22A thru BYD22D datasheet
BYG22A
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG22A thru BYD22D datasheet
BYG22
Vendor:Other Category:Other
BYG21M
Mfg:VISHAY Pack:DO-214AC D/C:07+ Vendor:Other Category:Other
BYG21K & BYG21M datasheet
BYG21K
Mfg:VISHAY Pack:DO-214AC (SMA) D/C:2009+ Vendor:Other Category:Other
BYG21K & BYG21M datasheet
BYG21
Vendor:Other Category:Other
BYG20J-E3-TR
Vendor:Other Category:Other
The BYG20J-E3-TR is one member of the BYG20J family which is designed as the fast silicon mesa SMD rectifier that can be used in (1)surface mounting; (2)fast rectifier; (3)freewheeling diodes in SMPS and converters; (4)s...
BYG20J
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG20D thru BYD20J datasheet
BYG20G
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG20D thru BYD20J datasheet
BYG20D
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG20D thru BYD20J datasheet
BYG20
Vendor:Other Category:Other
BYG10Y
Mfg:VISHAY Pack:DO-214AC (SMA) D/C:2009+ Vendor:Other Category:Other
BYG10D thru BYD10Y datasheet
BYG10M
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG10D thru BYD10Y datasheet
BYG10K
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG10D thru BYD10Y datasheet
BYG10J
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG10D thru BYD10Y datasheet
BYG10G
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG10D thru BYD10Y datasheet
BYG10D
Mfg:VISHAY Pack:05+ D/C:DO-214AC Vendor:Other Category:Other
BYG10D thru BYD10Y datasheet
BYG10
Vendor:Other Category:Other
BYD77G
Mfg:PHI D/C:05+ Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology.BYD77G is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77F
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. BYD77F is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77E
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. BYD77E is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77D
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. BYD77D is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77C
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. BYD77C is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77B
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. BYD77B is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77A
Mfg:Philips Pack:SMD D/C:09+ Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. BYD77A is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD77
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotecä(1) technology. BYD77 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73G
Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73G is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73F
Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73F is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73E
Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73E is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73D
Mfg:PHI Pack:SMD D/C:08+ Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73D is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73C
Mfg:PHI D/C:2005 Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73C is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73B
Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73B is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73A
Mfg:ph Pack:ph D/C:dc01 Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through Implotec(TM)(1) technology. BYD73A is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD73
Vendor:Other Category:Other
Cavity free cylindrical glass SOD81 package through ImplotecTM(1) technology. BYD73 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72G
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72G is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72F
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72F is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72E
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72E is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72D
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72D is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72C
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72C is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72B
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72B is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD72A
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package BYD72A is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD71G
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 BYD71G is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD71F
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 BYD71F is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
BYD71E
Vendor:Other Category:Other
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 BYD71E is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

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