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UPA821TC-T1 SOT463-81, UPA821TF, UPA821TF-E3

UPA821TC-T1 SOT463-81, UPA821TF, UPA821TF-E3 Selling Leads, Datasheet

MFG:NEC  Package Cooled:SOT-363  D/C:05+

UPA821TC-T1 SOT463-81, UPA821TF, UPA821TF-E3 Picture

UPA821TC-T1 SOT463-81, UPA821TF, UPA821TF-E3 Datasheet download

Five Points

Part Number: UPA821TC-T1 SOT463-81

 

MFG: NEC

Package Cooled: SOT-363

D/C: 05+

 

 

 
 
 
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  • UPA103G

  • Vendor: Nec D/C: 11+& Qty: SOP/14  Adddate: 2024-05-28
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  • Walsoon Group Ltd   China
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About UPA0J821MPD

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Datasheet: UPA0J821MPD

File Size: 91743 KB

Manufacturer: NICHICON [Nichicon corporation]

Download : Click here to Download

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UPA821TF Suppliers

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  • UPA103G

  • Vendor: Nec D/C: 11+& Qty: SOP/14  Adddate: 2024-05-28
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  • Walsoon Group Ltd   China
    Contact: Mr.StevenLee   MSN:steven200867@hotmail.com
    Tel: 86-755-82818867-808
    Fax: 86-755-82818852
    (17)

About UPA821TF

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Datasheet: UPA821TF

File Size: 41038 KB

Manufacturer: NEC [NEC]

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UPA821TF-E3 Suppliers

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  • UPA103G

  • Vendor: Nec D/C: 11+& Qty: SOP/14  Adddate: 2024-05-28
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  • Walsoon Group Ltd   China
    Contact: Mr.StevenLee   MSN:steven200867@hotmail.com
    Tel: 86-755-82818867-808
    Fax: 86-755-82818852
    (17)
  • UPA1400H

  • Vendor: Nec Pack: ZIP Qty: 2000  Adddate: 2024-05-28
  • Inquire Now
  • YingKe Electronic hong   China
    Contact: Mr.CHENHANWEI   MSN:yingkeda@hotmail.com
    Tel: 886-754-3806635
    Fax: 886-754-6672782
    (0)
  • UPA1422H

  • Vendor: Nec Pack: ZIP Qty: 1000  Adddate: 2024-05-28
  • Inquire Now
  • YingKe Electronic hong   China
    Contact: Mr.CHENHANWEI   MSN:yingkeda@hotmail.com
    Tel: 886-754-3806635
    Fax: 886-754-6672782
    (0)

About UPA0J821MPD

PDF/DataSheet Download

Datasheet: UPA0J821MPD

File Size: 91743 KB

Manufacturer: NICHICON [Nichicon corporation]

Download : Click here to Download

Related PDF Download

Related Part Number

UPA821TF General Description

The UPA821TF has two built-in low-voltage transistors which are designed for low-noise amplification in the VHF to UHF band. The two die are chosen from adjacent locations on the wafer. These features combined with the pin configuration make this device ideal for balanced or mirrored applications.Low noise figures, high gain, and high current capability equate to wide dynamic range and excellent linearity. The thinner package style allows for higher density designs.

UPA821TF Maximum Ratings

SYMBOLS

          PARAMETERS

UNITS

RATINGS

VCBO

Collector to Base Voltage

V

20

VCEO

Collector to Emitter Voltage

V

12

VEBO

Emitter to Base Voltage

V

3

IC

Collector Current

mA

1000

 PT

Total Power Dissipation
1 Die
2 Die2

mW
mW

150
200

TJ Junction Temperature   150
TSTG Storage Temperature   -65 to +150

 

 

 

 

 

 


Note:
1.Operation in excess of any one of these parameters may result in permanent damage.
2.When operating both devices, the power dissipation for either device should not exceed 110 mW.

 

 

UPA821TF Features

• LOW NOISE:NF = 1.2 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA
• HIGH GAIN:|S21E|2 = 9.0 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA
• SMALL PACKAGE STYLE:2 NE856 die in a 2 mm x 1.25 mm x 0.6 mm package

UPA821TF Connection Diagram

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